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WS512K32N-35G2UIA

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Manufacturer No WS512K32N-35G2UIA

Manufacturer Microsemi Corporation

Category SRAMs

Package QFP

Datasheet Datasheet

Description SRAM Module, 512KX32, 35ns, CMOS, CQFP68, 22.40 X 22.40 MM, 3.56 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68

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Type

Parameter

  • Width

    22.36 mm

  • Length

    22.36 mm

  • HTS Code

    8542.32.00.41

  • ECCN Code

    3A991.B.2.A

  • Pin Count

    68

  • Rohs Code

    No

  • Popularity

    0

  • Technology

    CMOS

  • Pbfree Code

    No

  • JESD-30 Code

    S-CQFP-G68

  • Memory Width

    32

  • Organization

    512KX32

  • Package Code

    QFP

  • JESD-609 Code

    e0

  • Package Shape

    SQUARE

  • Package Style

    FLATPACK

  • Surface Mount

    YES

  • Terminal Form

    GULL WING

  • Memory Density

    16777216 bit

  • Memory IC Type

    SRAM MODULE

  • Operating Mode

    ASYNCHRONOUS

  • Terminal Pitch

    1.27 mm

  • Access Time-Max

    35 ns

  • Number of Words

    524288 words

  • Parallel/Serial

    PARALLEL

  • Terminal Finish

    TIN LEAD

  • Part Package Code

    QFP

  • Seated Height-Max

    3.51 mm

  • Temperature Grade

    INDUSTRIAL

  • Terminal Position

    QUAD

  • Additional Feature

    USER CONFIGURABLE AS 2M X 8

  • Number of Functions

    1

  • Number of Terminals

    68

  • Package Description

    QFP,

  • Number of Words Code

    512000

  • Part Life Cycle Code

    Transferred

  • Qualification Status

    Not Qualified

  • Package Body Material

    CERAMIC, METAL-SEALED COFIRED

  • Reach Compliance Code

    compliant

  • Alternate Memory Width

    16

  • Operating Temperature-Max

    85°C

  • Operating Temperature-Min

    -40°C

  • Supply Voltage-Max (Vsup)

    5.5 V

  • Supply Voltage-Min (Vsup)

    4.5 V

  • Supply Voltage-Nom (Vsup)

    5 V

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Qty

Unit Price

Total Price

2102

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