WS128K32-25G4TIE

Details

Manufacturer No WS128K32-25G4TIE

Manufacturer Microsemi Corporation

Category SRAMs

Package QFF

Datasheet Datasheet

Description SRAM Module, 512KX8, 25ns, CMOS, CQFP68, 40 MM, 3.5 MM HEIGHT, CERAMIC, QFP-68

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Type

Parameter

  • Width

    39.6 mm

  • Length

    39.6 mm

  • HTS Code

    8542.32.00.41

  • ECCN Code

    3A991.B.2.A

  • Pin Count

    68

  • Rohs Code

    No

  • Popularity

    0

  • Technology

    CMOS

  • Pbfree Code

    No

  • JESD-30 Code

    S-CQFP-F68

  • Memory Width

    8

  • Organization

    512KX8

  • Package Code

    QFF

  • Package Shape

    SQUARE

  • Package Style

    FLATPACK

  • Surface Mount

    YES

  • Terminal Form

    FLAT

  • Memory Density

    4194304 bit

  • Memory IC Type

    SRAM MODULE

  • Operating Mode

    ASYNCHRONOUS

  • Terminal Pitch

    1.27 mm

  • Access Time-Max

    25 ns

  • Number of Words

    524288 words

  • Parallel/Serial

    PARALLEL

  • Part Package Code

    QFP

  • Seated Height-Max

    3.56 mm

  • Temperature Grade

    INDUSTRIAL

  • Terminal Position

    QUAD

  • Additional Feature

    USER CONFIGURABLE AS 128K X 32

  • Number of Functions

    1

  • Number of Terminals

    68

  • Package Description

    QFF,

  • Number of Words Code

    512000

  • Part Life Cycle Code

    Obsolete

  • Qualification Status

    Not Qualified

  • Package Body Material

    CERAMIC, METAL-SEALED COFIRED

  • Reach Compliance Code

    compliant

  • Alternate Memory Width

    16

  • Operating Temperature-Max

    85°C

  • Operating Temperature-Min

    -40°C

  • Supply Voltage-Max (Vsup)

    5.5 V

  • Supply Voltage-Min (Vsup)

    4.5 V

  • Supply Voltage-Nom (Vsup)

    5 V

  • Peak Reflow Temperature (Cel)

    NOTSPECIFIED

  • Time@Peak Reflow Temperature-Max (s)

    NOTSPECIFIED

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Total Price

4868

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