82S137A/BVA

Details

Manufacturer No 82S137A/BVA

Manufacturer NXP Semiconductors

Category OTP ROMs

Package DIP

Datasheet Datasheet

Description IC 1K X 4 OTPROM, 55 ns, CDIP18, 0.300 INCH, CERAMIC, DIP-18, Programmable ROM

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Type

Parameter

Width

7.62 mm
HTS Code

8542.32.00.71
ECCN Code

EAR99
Pin Count

18
Popularity

44
Technology

BIPOLAR
JESD-30 Code

R-GDIP-T18
Memory Width

4
Organization

1KX4
Package Code

DIP
Package Shape

RECTANGULAR
Package Style

IN-LINE
Surface Mount

NO
Terminal Form

THROUGH-HOLE
Memory Density

4096 bit
Memory IC Type

OTP ROM
Operating Mode

ASYNCHRONOUS
Terminal Pitch

2.54 mm
Access Time-Max

55 ns
Number of Words

1024 words
Parallel/Serial

PARALLEL
Part Package Code

DIP
Seated Height-Max

5.08 mm
Temperature Grade

MILITARY
Terminal Position

DUAL
Source Content uid

82S137A/BVA
Number of Functions

1
Number of Terminals

18
Package Description

DIP,
Number of Words Code

1000
Part Life Cycle Code

Obsolete
Qualification Status

Not Qualified
Package Body Material

CERAMIC, GLASS-SEALED
Reach Compliance Code

unknown
Output Characteristics

3-STATE
Operating Temperature-Max

125°C
Operating Temperature-Min

-55°C
Supply Voltage-Max (Vsup)

5.5 V
Supply Voltage-Min (Vsup)

4.5 V
Supply Voltage-Nom (Vsup)

5 V

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Qty

Unit Price

Total Price

19587

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