Width

7.62 mm

Length

22.86 mm

HTS Code

8542.32.00.71

ECCN Code

EAR99

Pin Count

18

Rohs Code

No

Popularity

18

Technology

BIPOLAR

Pbfree Code

No

Subcategory

OTP ROMs

JESD-30 Code

R-GDIP-T18

Memory Width

4

Organization

1KX4

Package Code

DIP

JESD-609 Code

e0

Package Shape

RECTANGULAR

Package Style

IN-LINE

Surface Mount

NO

Terminal Form

THROUGH-HOLE

Memory Density

4096 bit

Memory IC Type

OTP ROM

Operating Mode

ASYNCHRONOUS

Power Supplies

5 V

Terminal Pitch

2.54 mm

Access Time-Max

70 ns

Number of Words

1024 words

Parallel/Serial

PARALLEL

Screening Level

38535Q/M;38534H;883B

Terminal Finish

TIN LEAD

Part Package Code

DIP

Seated Height-Max

5.08 mm

Temperature Grade

MILITARY

Terminal Position

DUAL

Number of Functions

1

Number of Terminals

18

Package Description

DIP, DIP18,.3

Number of Words Code

1000

Part Life Cycle Code

Obsolete

Qualification Status

Not Qualified

Package Body Material

CERAMIC, GLASS-SEALED

Reach Compliance Code

unknown

Output Characteristics

3-STATE

Package Equivalence Code

DIP18,.3

Operating Temperature-Max

125°C

Operating Temperature-Min

-55°C

Supply Voltage-Max (Vsup)

5.5 V

Supply Voltage-Min (Vsup)

4.5 V

Supply Voltage-Nom (Vsup)

5 V