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5962-9318709H5X

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Manufacturer No 5962-9318709H5X

Manufacturer Microsemi Corporation

Category SRAMs

Package PGA

Datasheet Datasheet

Description SRAM Module, 128KX32, 20ns, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66

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Type

Parameter

  • Width

    27.3 mm

  • Length

    27.3 mm

  • HTS Code

    8542.32.00.41

  • ECCN Code

    3A991.B.2.A

  • Pin Count

    66

  • Rohs Code

    No

  • Popularity

    0

  • Technology

    CMOS

  • Pbfree Code

    No

  • JESD-30 Code

    S-CPGA-P66

  • Memory Width

    32

  • Organization

    128KX32

  • Package Code

    PGA

  • Package Shape

    SQUARE

  • Package Style

    GRID ARRAY

  • Surface Mount

    NO

  • Terminal Form

    PIN/PEG

  • Memory Density

    4194304 bit

  • Memory IC Type

    SRAM MODULE

  • Operating Mode

    ASYNCHRONOUS

  • Terminal Pitch

    2.54 mm

  • Access Time-Max

    20 ns

  • Number of Words

    131072 words

  • Parallel/Serial

    PARALLEL

  • Part Package Code

    PGA

  • Seated Height-Max

    4.34 mm

  • Temperature Grade

    MILITARY

  • Terminal Position

    PERPENDICULAR

  • Additional Feature

    USER CONFIGURABLE AS 512K X 8

  • Number of Functions

    1

  • Number of Terminals

    66

  • Package Description

    PGA,

  • Number of Words Code

    128000

  • Part Life Cycle Code

    Transferred

  • Qualification Status

    Not Qualified

  • Package Body Material

    CERAMIC, METAL-SEALED COFIRED

  • Reach Compliance Code

    compliant

  • Alternate Memory Width

    16

  • Operating Temperature-Max

    125°C

  • Operating Temperature-Min

    -55°C

  • Supply Voltage-Max (Vsup)

    5.5 V

  • Supply Voltage-Min (Vsup)

    4.5 V

  • Supply Voltage-Nom (Vsup)

    5 V

  • Peak Reflow Temperature (Cel)

    NOTSPECIFIED

  • Time@Peak Reflow Temperature-Max (s)

    NOTSPECIFIED

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Qty

Unit Price

Total Price

28545

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SRAM Module, 128KX32, 20ns, CMOS, CHIP66, HEX-IN-LINE, SINGLE CAVITY, WITH STANDOFFS-66

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