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WS512K32N-25H1I

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Manufacturer No WS512K32N-25H1I

Manufacturer Microsemi Corporation

Category SRAMs

Package PGA

Datasheet Datasheet

Description SRAM Module, 512KX32, 25ns, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66

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Type

Parameter

  • Width

    27.3 mm

  • Length

    27.3 mm

  • HTS Code

    8542.32.00.41

  • ECCN Code

    3A991.B.2.A

  • Pin Count

    66

  • Rohs Code

    No

  • Popularity

    3

  • Technology

    CMOS

  • Pbfree Code

    No

  • JESD-30 Code

    S-CPGA-P66

  • Memory Width

    32

  • Organization

    512KX32

  • Package Code

    PGA

  • JESD-609 Code

    e4

  • Package Shape

    SQUARE

  • Package Style

    GRID ARRAY

  • Surface Mount

    NO

  • Terminal Form

    PIN/PEG

  • Memory Density

    16777216 bit

  • Memory IC Type

    SRAM MODULE

  • Operating Mode

    ASYNCHRONOUS

  • Terminal Pitch

    2.54 mm

  • Access Time-Max

    25 ns

  • Number of Words

    524288 words

  • Parallel/Serial

    PARALLEL

  • Terminal Finish

    GOLD

  • Part Package Code

    PGA

  • Seated Height-Max

    4.6 mm

  • Temperature Grade

    INDUSTRIAL

  • Terminal Position

    PERPENDICULAR

  • Additional Feature

    USER CONFIGURABLE AS 2M X 8

  • Number of Functions

    1

  • Number of Terminals

    66

  • Package Description

    1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66

  • Number of Words Code

    512000

  • Part Life Cycle Code

    Transferred

  • Qualification Status

    Not Qualified

  • Package Body Material

    CERAMIC, METAL-SEALED COFIRED

  • Reach Compliance Code

    unknown

  • Alternate Memory Width

    16

  • Operating Temperature-Max

    85°C

  • Operating Temperature-Min

    -40°C

  • Supply Voltage-Max (Vsup)

    5.5 V

  • Supply Voltage-Min (Vsup)

    4.5 V

  • Supply Voltage-Nom (Vsup)

    5 V

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Qty

Unit Price

Total Price

4853

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