Details
Manufacturer No WS512K32N-17H2M
Manufacturer Microsemi Memory, Processors & Storage
Category SRAMs
Datasheet Datasheet
Description SRAM Module, 2MX8, 17ns, CMOS, CPGA66, 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66
Price
Call
Type
Parameter
Width
35.2 mm
Length
35.2 mm
HTS Code
8542.32.00.41
I/O Type
COMMON
Objectid
1546386467
ECCN Code
3A991.B.2.A
Risk Rank
9.26
Rohs Code
No
Technology
CMOS
Subcategory
SRAMs
JESD-30 Code
S-CPGA-P66
Memory Width
8
Organization
2MX8
Package Code
PGA
JESD-609 Code
e0
Package Shape
SQUARE
Package Style
GRID ARRAY
Surface Mount
NO
Terminal Form
PIN/PEG
Memory Density
16777216 bit
Memory IC Type
SRAM MODULE
Operating Mode
ASYNCHRONOUS
Power Supplies
5 V
Terminal Pitch
2.54 mm
Access Time-Max
17 ns
Number of Words
2097152 words
Parallel/Serial
PARALLEL
Terminal Finish
Tin/Lead (Sn/Pb)
Seated Height-Max
5.7 mm
Temperature Grade
MILITARY
Terminal Position
PERPENDICULAR
Additional Feature
CONFIGURABLE AS 512K X 32
Supply Current-Max
0.54 mA
Number of Functions
1
Number of Terminals
66
Package Description
1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66
Standby Current-Max
0.028 A
Standby Voltage-Min
2 V
Number of Words Code
2000000
Part Life Cycle Code
Obsolete
Qualification Status
Not Qualified
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Reach Compliance Code
unknown
Output Characteristics
3-STATE
Package Equivalence Code
PGA66,11X11
Operating Temperature-Max
125°C
Operating Temperature-Min
-55°C
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
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Qty
Unit Price
Total Price
13734
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