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WS512K32-55G2LQA

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Manufacturer No WS512K32-55G2LQA

Manufacturer Microsemi Corporation

Category SRAMs

Package QFP

Datasheet Datasheet

Description SRAM Module, 512KX32, 55ns, CMOS, CQFP68, 22.40 X 22.40 MM, 5.08 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68

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Type

Parameter

  • Width

    22.36 mm

  • Length

    22.36 mm

  • HTS Code

    8542.32.00.41

  • ECCN Code

    3A991.B.2.A

  • Pin Count

    68

  • Rohs Code

    No

  • Popularity

    0

  • Technology

    CMOS

  • Pbfree Code

    No

  • JESD-30 Code

    S-CQFP-G68

  • Memory Width

    32

  • Organization

    512KX32

  • Package Code

    QFP

  • Package Shape

    SQUARE

  • Package Style

    FLATPACK

  • Surface Mount

    YES

  • Terminal Form

    GULL WING

  • Memory Density

    16777216 bit

  • Memory IC Type

    SRAM MODULE

  • Operating Mode

    ASYNCHRONOUS

  • Terminal Pitch

    1.27 mm

  • Access Time-Max

    55 ns

  • Number of Words

    524288 words

  • Parallel/Serial

    PARALLEL

  • Screening Level

    MIL-STD-883

  • Part Package Code

    QFP

  • Seated Height-Max

    5.1 mm

  • Temperature Grade

    MILITARY

  • Terminal Position

    QUAD

  • Additional Feature

    USER CONFIGURABLE AS 2M X 8

  • Number of Functions

    1

  • Number of Terminals

    68

  • Package Description

    22.40 X 22.40 MM, 5.08 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68

  • Number of Words Code

    512000

  • Part Life Cycle Code

    Transferred

  • Qualification Status

    Not Qualified

  • Package Body Material

    CERAMIC, METAL-SEALED COFIRED

  • Reach Compliance Code

    unknown

  • Alternate Memory Width

    16

  • Operating Temperature-Max

    125°C

  • Operating Temperature-Min

    -55°C

  • Supply Voltage-Max (Vsup)

    5.5 V

  • Supply Voltage-Min (Vsup)

    4.5 V

  • Supply Voltage-Nom (Vsup)

    5 V

  • Peak Reflow Temperature (Cel)

    NOTSPECIFIED

  • Time@Peak Reflow Temperature-Max (s)

    NOTSPECIFIED

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Qty

Unit Price

Total Price

12848

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