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WS512K8-100CI

Details

Manufacturer No WS512K8-100CI

Manufacturer Microsemi Corporation

Category SRAMs

Package DIP

Datasheet Datasheet

Description SRAM Module, 512KX8, 100ns, CMOS, CDIP32, 0.600 INCH, DUAL CAVITY, HERMETIC SEALED, BOTTOM BRAZED, CERAMIC, DIP-32

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Type

Parameter

  • Width

    15.24 mm

  • Length

    40.6 mm

  • HTS Code

    8542.32.00.41

  • ECCN Code

    3A991.B.2.A

  • Pin Count

    32

  • Popularity

    0

  • Technology

    CMOS

  • JESD-30 Code

    R-CDIP-T32

  • Memory Width

    8

  • Organization

    512KX8

  • Package Code

    DIP

  • Package Shape

    RECTANGULAR

  • Package Style

    IN-LINE

  • Surface Mount

    NO

  • Terminal Form

    THROUGH-HOLE

  • Memory Density

    4194304 bit

  • Memory IC Type

    SRAM MODULE

  • Operating Mode

    ASYNCHRONOUS

  • Terminal Pitch

    2.54 mm

  • Access Time-Max

    100 ns

  • Number of Words

    524288 words

  • Parallel/Serial

    PARALLEL

  • Part Package Code

    DIP

  • Seated Height-Max

    5.08 mm

  • Temperature Grade

    INDUSTRIAL

  • Terminal Position

    DUAL

  • Number of Functions

    1

  • Number of Terminals

    32

  • Package Description

    DIP,

  • Number of Words Code

    512000

  • Part Life Cycle Code

    Transferred

  • Qualification Status

    Not Qualified

  • Package Body Material

    CERAMIC, METAL-SEALED COFIRED

  • Reach Compliance Code

    unknown

  • Operating Temperature-Max

    85°C

  • Operating Temperature-Min

    -40°C

  • Supply Voltage-Max (Vsup)

    5.5 V

  • Supply Voltage-Min (Vsup)

    4.5 V

  • Supply Voltage-Nom (Vsup)

    5 V

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