Width

1.6 mm

Family

LVC/LCX/Z

Length

2.9 mm

HTS Code

8542.39.00.01

ECCN Code

EAR99

Max I(ol)

0.024 A

Pin Count

5

Rohs Code

Yes

Popularity

82

Technology

CMOS

Pbfree Code

Yes

Subcategory

Gates

JESD-30 Code

R-PDSO-G5

Package Code

LSSOP

JESD-609 Code

e6

Logic IC Type

BUFFER

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Surface Mount

YES

Terminal Form

GULL WING

Packing Method

TR

Power Supplies

3.3 V

Terminal Pitch

0.95 mm

Schmitt Trigger

YES

Terminal Finish

TIN BISMUTH

Number of Inputs

1

Part Package Code

SOT-23

Seated Height-Max

1.45 mm

Temperature Grade

INDUSTRIAL

Terminal Position

DUAL

Source Content uid

SN74LVC1G17DBV3

Number of Functions

1

Number of Terminals

5

Package Description

LSSOP, TSOP5/6,.11,37

Prop. Delay@Nom-Sup

5.5 ns

Part Life Cycle Code

Obsolete

Qualification Status

Not Qualified

Load Capacitance (CL)

50 pF

Package Body Material

PLASTIC/EPOXY

Reach Compliance Code

compliant

Propagation Delay (tpd)

11 ns

Package Equivalence Code

TSOP5/6,.11,37

Operating Temperature-Max

85°C

Operating Temperature-Min

-40°C

Supply Voltage-Max (Vsup)

5.5 V

Supply Voltage-Min (Vsup)

1.65 V

Supply Voltage-Nom (Vsup)

3.3 V

Moisture Sensitivity Level

1

Peak Reflow Temperature (Cel)

260

Power Supply Current-Max (ICC)

0.01 mA

Time@Peak Reflow Temperature-Max (s)

30