WS57C010F-70DMB

Details

Manufacturer No WS57C010F-70DMB

Manufacturer e2v technologies

Category EPROMs

Package DIP

Datasheet Datasheet

Description UVPROM, 128KX8, 70ns, CMOS, CDIP32, 0.600 INCH, CERAMIC, DIP-32

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Type

Parameter

  • HTS Code

    8542.32.00.61

  • ECCN Code

    EAR99

  • Pin Count

    32

  • Popularity

    0

  • Technology

    CMOS

  • JESD-30 Code

    R-CDIP-T32

  • Memory Width

    8

  • Organization

    128KX8

  • Package Code

    DIP

  • Package Shape

    RECTANGULAR

  • Package Style

    IN-LINE

  • Surface Mount

    NO

  • Terminal Form

    THROUGH-HOLE

  • Memory Density

    1048576 bit

  • Memory IC Type

    UVPROM

  • Operating Mode

    ASYNCHRONOUS

  • Access Time-Max

    70 ns

  • Number of Words

    131072 words

  • Parallel/Serial

    PARALLEL

  • Screening Level

    MIL-STD-883 Class C

  • Part Package Code

    DIP

  • Terminal Position

    DUAL

  • Number of Functions

    1

  • Number of Terminals

    32

  • Package Description

    0.600 INCH, CERAMIC, DIP-32

  • Number of Words Code

    128000

  • Part Life Cycle Code

    Active

  • Qualification Status

    Not Qualified

  • Package Body Material

    CERAMIC, METAL-SEALED COFIRED

  • Reach Compliance Code

    compliant

  • Supply Voltage-Max (Vsup)

    5.5 V

  • Supply Voltage-Min (Vsup)

    4.5 V

  • Supply Voltage-Nom (Vsup)

    5 V

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Total Price

13544

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