Width

8 mm

Length

9 mm

HTS Code

8542.32.00.02

I/O Type

COMMON

ECCN Code

EAR99

Pin Count

54

Rohs Code

Yes

Popularity

0

Technology

CMOS

Access Mode

FOUR BANK PAGE BURST

Pbfree Code

Yes

Subcategory

DRAMs

JESD-30 Code

R-PBGA-B54

Memory Width

16

Organization

8MX16

Package Code

TFBGA

Self Refresh

YES

JESD-609 Code

e1

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, THIN PROFILE, FINE PITCH

Surface Mount

YES

Terminal Form

BALL

Memory Density

134217728 bit

Memory IC Type

SYNCHRONOUS DRAM

Operating Mode

SYNCHRONOUS

Power Supplies

3.3 V

Refresh Cycles

4096

Terminal Pitch

0.8 mm

Access Time-Max

7 ns

Number of Ports

1

Number of Words

8388608 words

Terminal Finish

TIN SILVER COPPER

Part Package Code

BGA

Seated Height-Max

1.1 mm

Temperature Grade

COMMERCIALEXTENDED

Terminal Position

BOTTOM

Additional Feature

AUTO/SELF REFRESH

Supply Current-Max

0.21 mA

Number of Functions

1

Number of Terminals

54

Package Description

TFBGA, BGA54,9X9,32

Standby Current-Max

0.00035 A

Number of Words Code

8000000

Part Life Cycle Code

Obsolete

Qualification Status

Not Qualified

Package Body Material

PLASTIC/EPOXY

Reach Compliance Code

compliant

Output Characteristics

3-STATE

Sequential Burst Length

1,2,4,8,FP

Interleaved Burst Length

1,2,4,8

Package Equivalence Code

BGA54,9X9,32

Operating Temperature-Max

75°C

Operating Temperature-Min

-25°C

Supply Voltage-Max (Vsup)

3.6 V

Supply Voltage-Min (Vsup)

3 V

Supply Voltage-Nom (Vsup)

3.3 V

Clock Frequency-Max (fCLK)

125 MHz

Peak Reflow Temperature (Cel)

260