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L8C203PC50

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Manufacturer No L8C203PC50

Manufacturer LOGIC Devices Inc

Category FIFOs

Package DIP

Datasheet Datasheet

Description FIFO, 2KX9, 50ns, Asynchronous, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28

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Type

Parameter

  • Width

    7.62 mm

  • Length

    35.052 mm

  • HTS Code

    8542.32.00.71

  • ECCN Code

    EAR99

  • Pin Count

    28

  • Rohs Code

    No

  • Cycle Time

    65 ns

  • Popularity

    0

  • Technology

    CMOS

  • JESD-30 Code

    R-PDIP-T28

  • Memory Width

    9

  • Organization

    2KX9

  • Package Code

    DIP

  • Output Enable

    NO

  • Package Shape

    RECTANGULAR

  • Package Style

    IN-LINE

  • Surface Mount

    NO

  • Terminal Form

    THROUGH-HOLE

  • Memory Density

    18432 bit

  • Operating Mode

    ASYNCHRONOUS

  • Terminal Pitch

    2.54 mm

  • Access Time-Max

    50 ns

  • Number of Words

    2048 words

  • Parallel/Serial

    PARALLEL

  • Part Package Code

    DIP

  • Seated Height-Max

    4.572 mm

  • Temperature Grade

    COMMERCIAL

  • Terminal Position

    DUAL

  • Additional Feature

    RETRANSMIT

  • Number of Functions

    1

  • Number of Terminals

    28

  • Package Description

    DIP,

  • Number of Words Code

    2000

  • Part Life Cycle Code

    Obsolete

  • Qualification Status

    Not Qualified

  • Package Body Material

    PLASTIC/EPOXY

  • Reach Compliance Code

    unknown

  • Output Characteristics

    3-STATE

  • Operating Temperature-Max

    70°C

  • Operating Temperature-Min

    0°C

  • Supply Voltage-Max (Vsup)

    5.5 V

  • Supply Voltage-Min (Vsup)

    4.5 V

  • Supply Voltage-Nom (Vsup)

    5 V

  • Moisture Sensitivity Level

    3

  • Peak Reflow Temperature (Cel)

    225

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Qty

Unit Price

Total Price

9434

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