K6F1008V2C-YF55T00

Details

Manufacturer No K6F1008V2C-YF55T00

Manufacturer Samsung Semiconductor

Category Memory

Datasheet Datasheet

Description

Price

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Type

Parameter

  • HTS

  • PPAP

    No

  • RoHS

  • EU RoHS

    Not Compliant

  • Mounting

    Surface Mount

  • DRAM Type

  • ECCN (US)

    EAR99

  • Inventory

    In Stock

  • Packaging

    Tape and Reel

  • Pin Count

    32

  • Automotive

    No

  • Lead Shape

    Gull-wing

  • PCB changed

    32

  • Part Status

    Obsolete

  • Timing Type

    Asynchronous

  • Architecture

  • Organization

  • Package Width

    11.8

  • Interface Type

  • Package Height

    1

  • Package Length

    8.4(Max)

  • Number of Ports

    1

  • Number of Words

    128K

  • Supplier Package

    TSOP-I

  • Chip Density (bit)

    1M

  • Process Technology

  • Data Bus Width (bit)

  • Max. Access Time (ns)

    55

  • Standard Package Name

    SOP

  • Data Rate Architecture

    SDR

  • Operating Current (mA)

    35

  • Address Bus Width (bit)

    17

  • Maximum Access Time (ns)

  • Maximum Clock Rate (MHz)

  • Number of Internal Banks

  • Number of Words per Bank

  • Number of Bits/Word (bit)

    8

  • Number of I/O Lines (bit)

  • Supplier Temperature Grade

    Industrial

  • Maximum Operating Temperature (°C)

    85

  • Minimum Operating Temperature (°C)

    -40

  • Maximum Operating Supply Voltage (V)

    3.6

  • Minimum Operating Supply Voltage (V)

    3

  • Typical Operating Supply Voltage (V)

    3.3

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Qty

Unit Price

Total Price

12624

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