Details
Manufacturer No K6F1008V2C-YF55T00
Manufacturer Samsung Semiconductor
Category Memory
Datasheet Datasheet
Description
Price
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Type
Parameter
HTS
PPAP
No
RoHS
EU RoHS
Not Compliant
Mounting
Surface Mount
DRAM Type
ECCN (US)
EAR99
Inventory
In Stock
Packaging
Tape and Reel
Pin Count
32
Automotive
No
Lead Shape
Gull-wing
PCB changed
32
Part Status
Obsolete
Timing Type
Asynchronous
Architecture
Organization
Package Width
11.8
Interface Type
Package Height
1
Package Length
8.4(Max)
Number of Ports
1
Number of Words
128K
Supplier Package
TSOP-I
Chip Density (bit)
1M
Process Technology
Data Bus Width (bit)
Max. Access Time (ns)
55
Standard Package Name
SOP
Data Rate Architecture
SDR
Operating Current (mA)
35
Address Bus Width (bit)
17
Maximum Access Time (ns)
Maximum Clock Rate (MHz)
Number of Internal Banks
Number of Words per Bank
Number of Bits/Word (bit)
8
Number of I/O Lines (bit)
Supplier Temperature Grade
Industrial
Maximum Operating Temperature (°C)
85
Minimum Operating Temperature (°C)
-40
Maximum Operating Supply Voltage (V)
3.6
Minimum Operating Supply Voltage (V)
3
Typical Operating Supply Voltage (V)
3.3
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Qty
Unit Price
Total Price
12624
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