HY62UF8100LLM-70I

Details

Manufacturer No HY62UF8100LLM-70I

Manufacturer SK Hynix Inc

Category SRAMs

Package TFBGA

Datasheet Datasheet

Description Standard SRAM, 128KX8, 70ns, CMOS, PBGA48, MICRO, BGA-48

Price

Call

Add To Cart RFQ Buy Now

Type

Parameter

  • Width

    6.2 mm

  • Length

    6.5 mm

  • HTS Code

    8542.32.00.41

  • ECCN Code

    EAR99

  • Pin Count

    48

  • Popularity

    0

  • Technology

    CMOS

  • JESD-30 Code

    R-PBGA-B48

  • Memory Width

    8

  • Organization

    128KX8

  • Package Code

    TFBGA

  • JESD-609 Code

    e1

  • Package Shape

    RECTANGULAR

  • Package Style

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Surface Mount

    YES

  • Terminal Form

    BALL

  • Memory Density

    1048576 bit

  • Memory IC Type

    STANDARD SRAM

  • Operating Mode

    ASYNCHRONOUS

  • Terminal Pitch

    0.75 mm

  • Access Time-Max

    70 ns

  • Number of Words

    131072 words

  • Parallel/Serial

    PARALLEL

  • Terminal Finish

    TIN SILVER COPPER

  • Part Package Code

    BGA

  • Seated Height-Max

    1.11 mm

  • Temperature Grade

    INDUSTRIAL

  • Terminal Position

    BOTTOM

  • Number of Functions

    1

  • Number of Terminals

    48

  • Package Description

    TFBGA,

  • Number of Words Code

    128000

  • Part Life Cycle Code

    Obsolete

  • Qualification Status

    Not Qualified

  • Package Body Material

    PLASTIC/EPOXY

  • Reach Compliance Code

    unknown

  • Operating Temperature-Max

    85°C

  • Operating Temperature-Min

    -40°C

  • Supply Voltage-Max (Vsup)

    3.3 V

  • Supply Voltage-Min (Vsup)

    2.7 V

  • Supply Voltage-Nom (Vsup)

    3 V

Send RFQ

Qty

Unit Price

Total Price

9684

call

call

Feature Products

As a leader in the electronic components industry, we are committed to providing the most comprehensive and accurate electronic component information and supplier prices.

Payment Method

©Copyright 2023 IZSOURCE All Rights Reserved