Details
Manufacturer No EDI88512LPA25F36C
Manufacturer Microsemi Corporation
Category SRAMs
Package DFP
Datasheet Datasheet
Description Standard SRAM, 512KX8, 25ns, CMOS, CDFP36, CERAMIC, DFP-36
Price
Call
Type
Parameter
Width
12.954 mm
Length
23.368 mm
HTS Code
8542.32.00.41
I/O Type
COMMON
ECCN Code
3A991.B.2.A
Pin Count
36
Rohs Code
No
Popularity
0
Technology
CMOS
Pbfree Code
No
Subcategory
SRAMs
JESD-30 Code
R-CDFP-F36
Memory Width
8
Organization
512KX8
Package Code
DFP
Package Shape
RECTANGULAR
Package Style
FLATPACK
Surface Mount
YES
Terminal Form
FLAT
Memory Density
4194304 bit
Memory IC Type
STANDARD SRAM
Operating Mode
ASYNCHRONOUS
Power Supplies
5 V
Terminal Pitch
1.27 mm
Access Time-Max
25 ns
Number of Words
524288 words
Parallel/Serial
PARALLEL
Part Package Code
DFP
Seated Height-Max
3.175 mm
Temperature Grade
COMMERCIAL
Terminal Position
DUAL
Additional Feature
TTL COMPATIBLE INPUTS/OUTPUTS
Supply Current-Max
0.225 mA
Number of Functions
1
Number of Terminals
36
Package Description
CERAMIC, DFP-36
Standby Current-Max
0.002 A
Standby Voltage-Min
2 V
Number of Words Code
512000
Part Life Cycle Code
Transferred
Qualification Status
Not Qualified
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Reach Compliance Code
unknown
Output Characteristics
3-STATE
Package Equivalence Code
FL36,.5
Operating Temperature-Max
70°C
Operating Temperature-Min
0°C
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Peak Reflow Temperature (Cel)
NOTSPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOTSPECIFIED
Send RFQ
Qty
Unit Price
Total Price
12739
call
call
As a leader in the electronic components industry, we are committed to providing the most comprehensive and accurate electronic component information and supplier prices.
Payment Method