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EDI88130CS25TB
Details
Manufacturer No EDI88130CS25TB
Manufacturer Microsemi Corporation
Category SRAMs
Package DIP
Datasheet Datasheet
Description Standard SRAM, 128KX8, 25ns, CMOS, CDIP32, 0.400 INCH, SIDE BRAZED, CERAMIC, DIP-32
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Type
Parameter
Width
10.16 mm
Length
40.64 mm
HTS Code
8542.32.00.41
ECCN Code
3A001.A.2.C
Pin Count
32
Rohs Code
No
Popularity
4
Technology
CMOS
Pbfree Code
No
JESD-30 Code
R-CDIP-T32
Memory Width
8
Organization
128KX8
Package Code
DIP
Package Shape
RECTANGULAR
Package Style
IN-LINE
Surface Mount
NO
Terminal Form
THROUGH-HOLE
Memory Density
1048576 bit
Memory IC Type
STANDARD SRAM
Operating Mode
ASYNCHRONOUS
Terminal Pitch
2.54 mm
Access Time-Max
25 ns
Number of Words
131072 words
Parallel/Serial
PARALLEL
Screening Level
MIL-STD-883
Part Package Code
DIP
Seated Height-Max
3.937 mm
Temperature Grade
MILITARY
Terminal Position
DUAL
Additional Feature
BATTERY BACKUP OPERATION
Number of Functions
1
Number of Terminals
32
Package Description
0.400 INCH, SIDE BRAZED, CERAMIC, DIP-32
Number of Words Code
128000
Part Life Cycle Code
Transferred
Qualification Status
Not Qualified
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Reach Compliance Code
unknown
Operating Temperature-Max
125°C
Operating Temperature-Min
-55°C
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Peak Reflow Temperature (Cel)
NOTSPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOTSPECIFIED
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Unit Price
Total Price
2773
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