HTS

Mfr

Tab

PPAP

Unknown

RoHS

Series

EU RoHS

Compliant

Package

Category

Small Signal

FET Type

Mounting

Surface Mount

ECCN (US)

EAR99

Inventory

In Stock

Packaging

Tape and Reel

Pin Count

3

Published

Automotive

Yes

Lead Shape

Gull-wing

FET Feature

PCB changed

3

Part Status

Obsolete

Power - Max

RoHS Status

Channel Mode

Enhancement

Channel Type

N

JESD-30 Code

Configuration

Single

JESD-609 Code

Mounting Type

Package Width

1.3

Surface Mount

Terminal Form

FET Technology

Operating Mode

Package / Case

Package Height

1(Max)

Package Length

2.9

Product Status

Terminal Finish

Supplier Package

SOT-23

Factory Lead Time

Additional Feature

Number of Elements

Process Technology

SIPMOS

Vgs(th) (Max) @ Id

Base Product Number

Operating Temperature

Standard Package Name

SOT

Number of Terminations

Rds On (Max) @ Id, Vgs

Transistor Application

Typical Fall Time (ns)

25

Typical Rise Time (ns)

3.1

Supplier Device Package

DS Breakdown Voltage-Min

Supplier Temperature Grade

Number of Elements per Chip

1

Transistor Element Material

Drain Current-Max (Abs) (ID)

Gate Charge (Qg) (Max) @ Vgs

Drain to Source Voltage (Vdss)

Maximum Power Dissipation (mW)

360

Typical Gate Charge @ 10V (nC)

1.78

Typical Gate Charge @ Vgs (nC)

1.78@10V

Maximum Gate Source Voltage (V)

±20

Typical Output Capacitance (pF)

8.5

Typical Turn-On Delay Time (ns)

2.7

Maximum Drain Source Voltage (V)

100

Moisture Sensitivity Level (MSL)

Typical Turn-Off Delay Time (ns)

9.9

Typical Gate to Drain Charge (nC)

0.77

Maximum Gate Threshold Voltage (V)

1.8

Typical Gate to Source Charge (nC)

0.055

Maximum Operating Temperature (°C)

150

Minimum Operating Temperature (°C)

-55

Input Capacitance (Ciss) (Max) @ Vds

Maximum Continuous Drain Current (A)

0.17

Typical Input Capacitance @ Vds (pF)

55@25V

Typical Reverse Recovery Charge (nC)

10.5

Maximum Drain Source Resistance (mOhm)

6000@10V

Current - Continuous Drain (Id) @ 25°C