Width

13 mm

Length

15 mm

HTS Code

8542.32.00.41

I/O Type

COMMON

ECCN Code

3A991.B.2.A

Pin Count

165

Rohs Code

No

Popularity

0

Technology

CMOS

Subcategory

SRAMs

JESD-30 Code

R-PBGA-B165

Memory Width

36

Organization

128KX36

Package Code

TBGA

JESD-609 Code

e0

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, THIN PROFILE

Surface Mount

YES

Terminal Form

BALL

Memory Density

4718592 bit

Memory IC Type

ZBT SRAM

Operating Mode

SYNCHRONOUS

Power Supplies

3.3 V

Terminal Pitch

1 mm

Access Time-Max

9 ns

Number of Words

131072 words

Parallel/Serial

PARALLEL

Terminal Finish

Tin/Lead (Sn/Pb)

Part Package Code

BGA

Seated Height-Max

1.2 mm

Temperature Grade

INDUSTRIAL

Terminal Position

BOTTOM

Supply Current-Max

0.25 mA

Number of Functions

1

Number of Terminals

165

Package Description

FBGA-165

Standby Current-Max

0.01 A

Standby Voltage-Min

3.14 V

Number of Words Code

128000

Part Life Cycle Code

Obsolete

Qualification Status

Not Qualified

Package Body Material

PLASTIC/EPOXY

Reach Compliance Code

not_compliant

Output Characteristics

3-STATE

Package Equivalence Code

BGA165,11X15,40

Operating Temperature-Max

85°C

Operating Temperature-Min

-40°C

Supply Voltage-Max (Vsup)

3.465 V

Supply Voltage-Min (Vsup)

3.135 V

Supply Voltage-Nom (Vsup)

3.3 V

Clock Frequency-Max (fCLK)

83 MHz