Details
Manufacturer No AM27X256-150XC
Manufacturer AMD
Category MASK ROMs
Package DIE
Datasheet Datasheet
Description MASK ROM, 32KX8, 150ns, CMOS, DIE
Price
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Type
Parameter
HTS Code
8542.32.00.71
ECCN Code
EAR99
Pin Count
28
Popularity
0
Technology
CMOS
Subcategory
MASK ROMs
JESD-30 Code
R-XUUC-N28
Memory Width
8
Organization
32KX8
Package Code
DIE
Package Shape
RECTANGULAR
Package Style
UNCASED CHIP
Surface Mount
YES
Terminal Form
NO LEAD
Memory Density
262144 bit
Memory IC Type
MASK ROM
Operating Mode
ASYNCHRONOUS
Power Supplies
5 V
Access Time-Max
150 ns
Number of Words
32768 words
Parallel/Serial
PARALLEL
Part Package Code
DIE
Temperature Grade
COMMERCIAL
Terminal Position
UPPER
Supply Current-Max
0.03 mA
Number of Functions
1
Number of Terminals
28
Package Description
DIE, DIE OR CHIP
Standby Current-Max
0.0001 A
Number of Words Code
32000
Part Life Cycle Code
Obsolete
Qualification Status
Not Qualified
Package Body Material
UNSPECIFIED
Reach Compliance Code
unknown
Output Characteristics
3-STATE
Package Equivalence Code
DIE OR CHIP
Operating Temperature-Max
70°C
Operating Temperature-Min
0°C
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
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Qty
Unit Price
Total Price
4326
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