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5962-9561307HYX

Details

Manufacturer No 5962-9561307HYX

Manufacturer Microsemi Corporation

Category SRAMs

Package DIP

Datasheet Datasheet

Description Standard SRAM, 512KX8, 35ns, CMOS, CDIP32, DIP-32

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Type

Parameter

  • Width

    15.24 mm

  • Length

    42.8 mm

  • HTS Code

    8542.32.00.41

  • ECCN Code

    3A991.B.2.A

  • Pin Count

    32

  • Rohs Code

    No

  • Popularity

    1

  • Technology

    CMOS

  • Pbfree Code

    No

  • JESD-30 Code

    R-CDIP-T32

  • Memory Width

    8

  • Organization

    512KX8

  • Package Code

    DIP

  • Package Shape

    RECTANGULAR

  • Package Style

    IN-LINE

  • Surface Mount

    NO

  • Terminal Form

    THROUGH-HOLE

  • Memory Density

    4194304 bit

  • Memory IC Type

    STANDARD SRAM

  • Operating Mode

    ASYNCHRONOUS

  • Terminal Pitch

    2.54 mm

  • Access Time-Max

    35 ns

  • Number of Words

    524288 words

  • Parallel/Serial

    PARALLEL

  • Screening Level

    MIL-STD-883

  • Part Package Code

    DIP

  • Seated Height-Max

    5.13 mm

  • Temperature Grade

    MILITARY

  • Terminal Position

    DUAL

  • Additional Feature

    LG-MAX

  • Number of Functions

    1

  • Number of Terminals

    32

  • Package Description

    DIP,

  • Number of Words Code

    512000

  • Part Life Cycle Code

    Transferred

  • Qualification Status

    Not Qualified

  • Package Body Material

    CERAMIC, METAL-SEALED COFIRED

  • Reach Compliance Code

    compliant

  • Operating Temperature-Max

    125°C

  • Operating Temperature-Min

    -55°C

  • Supply Voltage-Max (Vsup)

    5.5 V

  • Supply Voltage-Min (Vsup)

    4.5 V

  • Supply Voltage-Nom (Vsup)

    5 V

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Qty

Unit Price

Total Price

12826

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